| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor wafer and a method of manufacturing a semiconductor integrated circuit apparatus, capable of selecting cleaning and drying conditions with which the generation of watermark is reduced, in a simple manner and moreover, at low cost. Ž<P>SOLUTION: In the semiconductor wafer which serves as a TEG by which a watermark can be easily detected, there are provided a first region including a first watermark detecting pattern in which the same patterns are repeated and arranged in a first direction and a second region that includes a second watermark detecting pattern, in which the same patterns are repeated and arranged in a second direction orthogonal to the first direction. A cleaning and drying condition with which the watermark becomes minimum is searched using the semiconductor wafer, and the semiconductor wafer that forms a semiconductor integrated circuit having actual circuit functions is cleaned and dried by the cleaning and drying condition. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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