| 摘要 |
<P>PROBLEM TO BE SOLVED: To carry out mirror finishing without a polishing flaw even on a large-area silicon wafer or the like; to improve the flatness of a working surface 16 by applying uniform pressure on the whole large-area working surface 16 for polishing. <P>SOLUTION: As slurry 26 mixed with diamond abrasive grains 24 is pressed onto one surface 18 toward the other surface 20 of a porous plate 12 having a large number of continuous pores 22 opening from the one surface 18 to the other surface 20, the other surface 20 is pressed against the working surface 16 of a polished material 14 so that the other surface 20 and the working surface 16 are rubbed together, thereby polishing the polished material 14. A lot of the diamond abrasive grains 24 are trapped in the openings 28 of the continuous pores 22 on the other surface 20 of the porous plate 12, thereby exhibiting a favorable and stable polishing function. <P>COPYRIGHT: (C)2010,JPO&INPIT |
