| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin sealing apparatus capable of reliably filling resin between wiring boards stacked via a connection bump without causing a failure. <P>SOLUTION: A resin sealing apparatus includes: a lower die 12; an upper die 14 which is arranged over the lower die, on the lower surface side of which a recessed portion 14a is formed, and to the bottom surface peripheral edge of the recessed portion 14a of which a projection 5 projecting toward an opening side to raise a bottom partially is formed; and a protective film 20 formed at the lower surface side of the upper die 14 and attached along the recessed surface of the recessed portion 14a by suction and adsorption. The stacked wiring board 30 for which the plurality of wiring boards 32 and 34 are stacked via the connection bump 36 is sealed with resin by making a fused resin flow into a cavity C including a space between the stacked wiring substrates 30 from a resin supplying portion B in a state of disposing and holding it between the lower die 12 and the recessed portion of the upper die 14. <P>COPYRIGHT: (C)2010,JPO&INPIT |
