METHOD AND APPARATUS FOR CONTROLLING RESIDUAL STRESS OF PCB AND FPCB

摘要

PURPOSE: A thermal process control method for removing a residual stress of a plating layer for a former autism casing, and an apparatus thereof are provided to prevent a production of defective products by controlling the residual stress of the product. CONSTITUTION: A thermal process control method for removing a residual stress of a plating layer for a former autism casing comprises the following steps: inputting a recrystallization activation energy of a sample to heat process into a controller(S10); monitoring a goal cumulative energy value to the controller after setting a allowable residual stress target value of the sample(S20); and determining whether to cool the sample based on the monitored cumulative energy value(S30).