NON-SHRINKING CERAMIC SUBSTRATE, AND METHOD OF MANUFACTURING NON-SHRINKING CERAMIC SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a non-shrinking ceramic substrate capable of improving a failure of electrode connectivity caused by a void, and to provide a method of manufacturing the non-shrinking ceramic substrate.

SOLUTION: The method of manufacturing the non-shrinking ceramic substrate includes: a step of preparing a ceramic laminate 100 having a via electrode 110 formed therein; a step of firing the ceramic laminate 100; and a step of performing plating to fill the void generated in the step of firing the ceramic laminate with a plating material to form a plating part 150.

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