| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a heat dissipation function to heat to be generated in an inductor by combining and unifying of a circuit element and the inductor. SOLUTION: The semiconductor device is provided with: a first lead 10; a second lead 12 which is arranged by being separated from the first lead 10; the inductor L which is mounted on the surface of the first lead 10; the circuit element which is mounted on the second lead 12 and electrically connected to the inductor L by outer leads of the first lead 10 and the second lead 12; and a first seal 20 which exposes the rear surface of the first lead 10 and seals the inductor L and the circuit element. COPYRIGHT: (C)2010,JPO&INPIT |
