| 发明名称 |
MANUFACTURE METHOD FOR MULTI-ROW LEADLESS FRAME AND SEMICONDUCTOR PACKAGE |
| 摘要 |
<p>PURPOSE: A method for manufacturing a multi-row type leadless frame is provided to form the fine pattern of an input and output terminal using an etched sheet in order to form the pattern. CONSTITUTION: A first etching is performed on each sheet(ST11). A circuit is formed after a lamination process is performed(ST12). A plating treatment and a delaminating process are performed(ST13, ST14). The sheet is cut into a strip(ST15). A semiconductor chip is mounted on a multi-row type leadless frame. An epoxy molding is performed(ST16). A lower part etching is performed(ST17).</p> |
| 申请公布号 |
KR20100044309(A) |
申请公布日期 |
2010.04.30 |
| 申请号 |
KR20080103390 |
申请日期 |
2008.10.22 |
| 申请人 |
LG INNOTEK CO., LTD. |
发明人 |
LEE, SUNG WON;LEE, HYUNG EUI;SEO, YEONG UK;RYU, SUNG WUK;LEE, HYUK SOO |
| 分类号 |
H01L21/60;H01L23/48 |
主分类号 |
H01L21/60 |
| 代理机构 |
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