SHAPE OF WIRE LOOP, SEMICONDUCTOR DEVICE PROVIDED WITH WIRE LOOP HAVING SUCH A SHAPE AND WIRE BONDING METHOD

摘要

A WIRE LOOP INCLUDES A WIRE (3) CONNECTING A FIRST BONDING POINT (A) AND A SECOND BONDING POINT (Z) THERETHROUGH, WHEREIN AN ADDITIONAL WIRE LOOP (P) IS FORMED AFTER WIRE BONDING AT THE SECOND BONDING POINT (Z) WITHOUT CUTTING THE WIRE (3) AND THE ADDITIONAL WIRE LOOP (P) IS BONDED TO THE SECOND BONDING POINT (Z) OR TO THE VICINITY THEREOF WHILE PART OF THE WIRE (3) IS CRUSHED.