| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device capable of achieving high heat dissipation and high brightness while achieving size reduction. <P>SOLUTION: A semiconductor light emitting device A1 includes one or more semiconductor light emitting elements, a resin package 4 surrounding the semiconductor light emitting elements, and a lead which has a die-bonding pad for performing the die bonding of the semiconductor light emitting elements, and in which an exposed surface 12 opposite to the die-bonding pad is exposed from the resin package 4, and the exposed surface 12 is surrounded by the resin package 4. <P>COPYRIGHT: (C)2010,JPO&INPIT |
