| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an operation method of a vacuum pump and a method of manufacturing a semiconductor device, which are capable of suppressing adhesion of reaction products. Ž<P>SOLUTION: In the operation method of a vacuum pump 22 including a casing 22 having an air inlet 30 and an air outlet 34, a rotor 38 provided in an internal space 36 of the casing between the air inlet and the air outlet, and a motor 44 rotating the rotor, the vacuum pump is operated while introducing heated purge gas into the internal space through a hole 46 reaching the internal space. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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