CHEMICAL MECHANICAL POLISHING PAD HAVING INTEGRALLY MOLDED IDENTIFICATION MECHANISM

摘要

PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing pad having a polishing layer whose polishing surface is adapted to polish a substrate.

SOLUTION: A polishing layer 10 has an integrally molded identification mechanism; the integrally molded identification mechanism is non-polishing active and has at least two visually different characteristics, at least one of which is marked with a non-color base and at least one of which is marked with a color base; and the at least two visually different characteristics allow a chemical mechanical polishing pad to be uniquely identified and selected as a type of chemical mechanical polishing pad from among multiple chemical mechanical polishing pads, thus the polishing layer having the polishing surface to be adapted to polish a substrate. In addition, methods for producing such a polishing layer and for polishing a substrate using the same are provided.

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