| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electroplating method which can form a plated film having uniform film thickness, when plating a plurality of articles to be plated using the same holder. Ž<P>SOLUTION: A holder for plating fixes/holds a plurality of the articles to be plated on/in the same plane, and has through holes at positions corresponding to the respective articles to be plated, in a shielding plate that is arranged between an anode and the article to be plated which is a cathode. The article to be plated has a polygonal shape. The through hole of the shielding plate has a shape of which each corner of the polygonal shape is chamfered so as to form a curve. The electroplating method includes: determining a relationship between normal positions of one article to be plated and the through hole corresponding to the article from the relationships between the plated film thickness at a predetermined position in a test electroplating process and a distance from the predetermined position to the center of the article to be plated; and electroplating the article to be plated at the determined normal position. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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