| 摘要 |
<P>PROBLEM TO BE SOLVED: To properly prevent a lead terminal from lifting, when performing the bonding of a wiring member, without having to paste the lead terminal to a substrate in advance, in a molded package that is sealed with a mold resin after the substrate and the lead terminal are connected, using a wiring member. <P>SOLUTION: A lead terminal 30 is mounted on a support base 100 using the lead terminal 30 with an extension part 30a, which extends from the edge of a substrate 10 so that the lead terminal 30 overlaps the substrate 10. The lead terminal 30 is fixed as the substrate 10 presses down on the extension part 30a of the lead terminal from above; while direct contact is made between the other plate surface of the substrate 10 and the extension part 30a. In this fixed state, the lead terminal 30 and one side of the plate surface of the substrate 10 is wire-connected by the wiring member 40 ; thereafter, sealing is made using a mold resin 50; and since the contact part of the extension part 30a and the other plate surface of the substrate 10 is sealed with the mold resin 50, the two members of 30a and 10 are fixed. <P>COPYRIGHT: (C)2010,JPO&INPIT |
