| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition, a film of which after curing ensures physical properties comparable to those of a film cured at a high temperature and which inhibits corrosion of copper and copper alloy of metal wiring, a metal layer, etc., a method for producing a patterned curing film, and to provide electronic components. <P>SOLUTION: The photosensitive resin composition comprises (a) a polybenzoxazole precursor, having a repeating unit represented by general formula (1), (b) a photosensitive agent, (c) a solvent and (d) at least one compound selected from among a group, consisting of a heterocyclic compound, thiourea and a compound having a mercapto group, where U or V represents a divalent organic group, and at least one of U and V is a group containing a 1C-30C aliphatic chain structure. <P>COPYRIGHT: (C)2010,JPO&INPIT |
