| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve in-wafer face uniformity, while reducing the occupied floor area. <P>SOLUTION: This substrate processing apparatus is provided with: a boat 217, moving between a waiting chamber and a processing chamber by holding a plurality of wafers 200; a transferring device 50 installed in the waiting chamber for transferring a plurality of wafers in a batch to the boat; and a wafer transfer mechanism 125 for transferring the wafers to the transferring device. The boat is provided a plurality of placing surfaces on which the wafers are respectively placed, and the transfer device is provided with a rotary actuator 53; a column 56 is erected vertically on a rotary stand 55 of the rotary actuator; and the same number of support parts 57, having a shape surrounding the half of the outer periphery of the placing surface as the number of placing faces, are formed on the column. <P>COPYRIGHT: (C)2010,JPO&INPIT |
