发明名称 APPARATUS OF MANUFACTURING SEMICONDUCTOR, METHOD OF DETECTING LOAD, AND BONDING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To prevent breakdown of a substrate by detecting overload that operates to the transferred substrate. Ž<P>SOLUTION: A transfer apparatus 30 mounted on an X-axis table 20, which is movable in a transfer direction A, has: a transfer apparatus body 31; an upper claw member 40 having an upper claw 42; a lower claw member 50 having a lower claw 52; a driving apparatus 60 that moves up and down the upper claw member 40 and the lower claw member 50; and a control unit 80 that controls a bonding apparatus 1 as a whole. In addition, the upper claw 42 and the lower claw 52 are forced in the transfer direction A, and an overload detecting apparatus 70 detecting that the upper claw 42 moves with reference to an upper claw arm 41 is provided. When a lead frame F collides with a magazine or the like, the upper claw 42 and the lower claw 52 that clamp the lead frame F move in an opposed direction of the transfer direction A, thereby the overload detecting apparatus 70 detects that overload is applied to the lead frame F. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010097995(A) 申请公布日期 2010.04.30
申请号 JP20080265364 申请日期 2008.10.14
申请人 SHINKAWA LTD 发明人 MAKI SHINJI
分类号 H01L21/50;H01L21/52;H01L21/60 主分类号 H01L21/50
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