| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate conveying apparatus and a substrate conveying method capable of properly bonding a semiconductor die or the like to a substrate. Ž<P>SOLUTION: An X-axis table 30 which can be moved in a conveying direction A by the drive of an X-axis moving device 20 is mounted with an upper pawl member 40, a lower pawl member 50, a substrate pushing member 60 extending in a direction perpendicular with respect to the conveying direction A along a bonding stage 2, and a drive device 70 for moving the upper pawl member 40, the lower pawl member 50 and the substrate pushing member 60 vertically. When a semiconductor die or the like is bonded to a substrate F, the substrate F is pushed to the bonding stage 2 by the substrate pushing member 60 while being clamped between the upper pawl member 40 and the lower pawl member 50. When the substrate F is exchanged, the clamp of the substrate F by the upper pawl member 40 and the lower pawl member 50 is released, and the substrate pushing member 60 is highly lifted. When the substrate F is conveyed, the substrate pushing member 60 is slightly lifted while the substrate F is clamped by the upper pawl member 40 and the lower pawl member 50. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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