发明名称 LASER CRYSTALLIZATION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a laser crystallization method capable of crystallizing an amorphous silicon thin film only on an area on which a thin film transistor is formed. SOLUTION: A crystallization method of irradiating an amorphous silicon thin film 2 formed on a substrate 1 with a laser beam to carry out crystallization, includes: an absorbent printing step of printing an absorbent layer 3 on a desired local area of the amorphous silicon thin film 2; and a laser annealing step of crystallizing the local area of the amorphous silicon thin film 2 by irradiating the amorphous silicon thin film 4 including the local area with a semiconductor laser beam L having a wavelength absorbable by the absorbent layer 3 and unabsorbable by the amorphous silicon thin film 2 for heating the absorbent layer 3. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010098003(A) 申请公布日期 2010.04.30
申请号 JP20080265612 申请日期 2008.10.14
申请人 OSAKA UNIV;JAPAN STEEL WORKS LTD:THE 发明人 JITSUNO TAKAHISA;TOKUMURA KEIU;TOGASHI RYOTARO;INAMI TOSHIO;KUSAMA HIDEAKI;GOTO TATSUMI
分类号 H01L21/20;H01L21/336;H01L29/786 主分类号 H01L21/20
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