发明名称 |
LASER CRYSTALLIZATION METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a laser crystallization method capable of crystallizing an amorphous silicon thin film only on an area on which a thin film transistor is formed. SOLUTION: A crystallization method of irradiating an amorphous silicon thin film 2 formed on a substrate 1 with a laser beam to carry out crystallization, includes: an absorbent printing step of printing an absorbent layer 3 on a desired local area of the amorphous silicon thin film 2; and a laser annealing step of crystallizing the local area of the amorphous silicon thin film 2 by irradiating the amorphous silicon thin film 4 including the local area with a semiconductor laser beam L having a wavelength absorbable by the absorbent layer 3 and unabsorbable by the amorphous silicon thin film 2 for heating the absorbent layer 3. COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010098003(A) |
申请公布日期 |
2010.04.30 |
申请号 |
JP20080265612 |
申请日期 |
2008.10.14 |
申请人 |
OSAKA UNIV;JAPAN STEEL WORKS LTD:THE |
发明人 |
JITSUNO TAKAHISA;TOKUMURA KEIU;TOGASHI RYOTARO;INAMI TOSHIO;KUSAMA HIDEAKI;GOTO TATSUMI |
分类号 |
H01L21/20;H01L21/336;H01L29/786 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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