发明名称 |
BONDING METHOD AND BONDED BODY |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding method allowing a bonding film disposed so as to bond two base members to each other to exhibit excellent solvent resistance, and to provide a bonded body with excellent solvent resistance bonded by the bonding method. <P>SOLUTION: The bonding method includes the steps of: preparing the first base member 21 and the second base member 22 to be bonded to each other with a bonding film interposed therebetween; supplying a liquid material containing silicone materials to at least one of the first base member 21 and the second base member 22 so as to form a liquid film; drying the liquid film so as to obtain a bonding film 3 on the at least one of the first base member 21 and the second base member 22; heating the bonding film 3 so as to cross-link the silicone materials contained in the bonding film 3 to each other; and applying energy to the bonding film 3 so as to develop adhesiveness around a surface 32 of the bonding film 3 so as to obtain a bonded body 1 in which the first base member 21 and the second base member 22 are bonded to each other with the bonding film 3 interposed therebetween. <P>COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010095595(A) |
申请公布日期 |
2010.04.30 |
申请号 |
JP20080266673 |
申请日期 |
2008.10.15 |
申请人 |
SEIKO EPSON CORP |
发明人 |
NAITO NOBUHIRO;SATO MITSURU;YAMAMOTO TAKATOMO;IMAMURA MINEHIRO |
分类号 |
C09J183/04;B41J2/045;B41J2/055;B41J2/16;C09J5/02;C09J5/06;C09J183/06 |
主分类号 |
C09J183/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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