| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem in the prior art wherein, in a structure in which a dielectric substrate constituting a high frequency circuit is connected to a metal plate, two elements having each different thermal expansion coefficient are connected, so that there is a risk that the dielectric substrate constituting the high frequency circuit may be broken because of a temperature change or impact by vibration in a severe environment when being manufactured or loaded on a vehicle. <P>SOLUTION: A high frequency module includes: a high frequency circuit board wherein a high frequency circuit for transmitting and receiving a high frequency signal is formed on one surface of the dielectric substrate, and a first terminal for transmitting and receiving a high frequency signal is provided on the same surface; and a metal base wherein a second terminal connected to the first terminal is formed on one surface of a metal plate, and a third terminal connected to a high frequency antenna is formed on the other surface, and a waveguide connected to the second and third terminals and allowing the high frequency signal to pass is provided. The metal base is constituted by superposing one or more metal plates, and the metal base includes each protrusion on four sides. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
