| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device with reduced thickness of a device, in particular, remarkably reduced mounting height of a package-on-package structure or the like, and excelling in a heat radiation property. <P>SOLUTION: This semiconductor device includes: a laminate structure 20 where two small-sized and large-sized semiconductor elements 1, 2 are arranged oppositely to each other to set the small-sized semiconductor element 1 in the lower tier, and are electrically connected to each other through micro-bumps 3; and a cavity substrate 5 having a recessed part 6 or an opening 11. At least the small-sized semiconductor element 1 is housed in the recessed part 6 or the opening 11 of the cavity substrate 5, and the large-sized semiconductor element 2 in the upper tier is connected to the cavity substrate 5 through stud bumps 7. A sealing resin layer 8 is filled and formed in the recessed part 6 or the opening 11, and the back face of the large-sized semiconductor element 2 is exposed from the sealing resin layer 8. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
