发明名称 |
SUBSTRATE FOR POWER MODULE WITH HEAT SINK, POWER MODULE WITH HEAT SINK, SUBSTRATE FOR POWER MODULE WITH BUFFER LAYER, AND METHOD OF MANUFACTURING SUBSTRATE FOR POWER MODULE WITH HEAT SINK |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate for a power module with a heat sink, which can efficiently diffuse heat generated from an electronic component or the like and having high heat cycle reliability. <P>SOLUTION: The substrate for the power module with the heat sink includes: the substrate 10 for the power module where a circuit layer 12 is formed on one surface of an insulating substrate 11; and the heat sink 4 comprising aluminum or an aluminum alloy. A buffer layer 30 comprising an aluminum base composite material for which the aluminum or the aluminum alloy is filled in a carbonaceous member is provided between the insulating substrate 11 and the heat sink 4, wherein the thermal expansion coefficient K of the buffer layer 30 is in the relation of Kc<K<Kt for the thermal expansion coefficient Kc of the insulating substrate 11 and the thermal expansion coefficient Kt of the heat sink 4, and a skin layer 31 comprising the aluminum or the aluminum alloy is formed on the side of the heat sink 4 of the buffer layer 30. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
申请公布号 |
JP2010098059(A) |
申请公布日期 |
2010.04.30 |
申请号 |
JP20080266510 |
申请日期 |
2008.10.15 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
HAYASHI HIROMASA;NAGATOMO YOSHIYUKI;NAGASE TOSHIYUKI;KUROMITSU YOSHIO;SUZUKI NOBUYUKI |
分类号 |
H01L23/373 |
主分类号 |
H01L23/373 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|