| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board and a method of manufacturing the printed circuit board, in which the printed circuit board has solder bumps each having a round-formed pad connection face with a large connection area for connecting a connecting pad so that connection reliability may be improved, while having a uniform bump-formation height. SOLUTION: The printed circuit board includes round solder bumps, having a plurality of vertically-disposed circuit layers 530; insulating layers 600 interposed in between the circuit layers 530; lower connecting pads 515 formed on the lowest of the plurality of circuit layers 530; and solder bumps 300 each being electrically connecting to the lower connecting pad 515, while having the round-formed pad connecting face and the other flat face. COPYRIGHT: (C)2010,JPO&INPIT |
