| 摘要 |
PROBLEM TO BE SOLVED: To provide an acoustic wave apparatus preventing alloy generation between different kinds of metals and peeling of a protective film on an element side pad and improving bonding strength. SOLUTION: The element side pad 7a of an acoustic wave element mounted on a mounting board includes a first electrode part 30 and a second electrode part 40. The first electrode part 30 is formed on one principal surface 5a of a piezoelectric substrate 5 and includes at least an Al layer 32. The second electrode part 40 is formed in contact with the center part 30s of one principal surface 30a of the first electrode part 30 and includes at least an Au layer 42 exposed to one principal surface 42s. The protective film 29a is extended to the outer periphery 30k of the first electrode part 30 and the periphery 30t of the center part 30s of one principal surface 30a, and a part 29s extended to the periphery 30t of the center part 30s of one principal surface 30a of the first electrode part 30 is held between the first electrode part 30 and the second electrode part 40. COPYRIGHT: (C)2010,JPO&INPIT |
