发明名称 METHOD FOR CUTTING MOTHER GLASS SUBSTRATE FOR DISPLAY AND BRITTLE MATERIAL SUBSTRATE, AND METHOD FOR MANUFACTURING DISPLAY
摘要 <P>PROBLEM TO BE SOLVED: To reduce a number of processes on cutting laminated glass. <P>SOLUTION: A method for cutting the mother glass substrate 1 of a display panel including a first glass substrate G1 and a second glass substrate G2 laminated together by a sealing material 5 partitioning a plurality of cells arranged in a matrix form is provided. In a first process, a scheduled process line L1 is arranged in a gap between the sealing materials 5 of the adjacent cells, and a laser beam is irradiated along the scheduled process line L1 to form a scribe line on the first glass substrate G1. In a second process, a laser beam is irradiated along the scheduled process line L1 on the second glass substrate G2, and the vicinity of an area 40 to be irradiated by a laser beam is cooled to break the second glass substrate G2. Stress, generated when the second glass substrate G2 is broken, reaches the first glass substrate G1 through the sealing material 5, thereby the first glass substrate G1 is broken along the scribe line at substantially same time with the breakage of the second glass substrate G2. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010095414(A) 申请公布日期 2010.04.30
申请号 JP20080268706 申请日期 2008.10.17
申请人 LINKSTAR JAPAN CO LTD 发明人 KAMEI MASAYUKI
分类号 C03B33/07;B23K26/073;B23K26/38;B23K26/40;B23K101/40;C03B33/09;G02F1/13;G02F1/1333;H01J9/24;H01J11/02;H01J11/22;H01J11/34;H01J17/16 主分类号 C03B33/07
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