| 摘要 |
PURPOSE: A camera module is provided to include an image sensor and a processing chip in one package, thereby reducing the efforts for electrically connecting an additional chip to a camera module. CONSTITUTION: A camera module includes an image sensor(211), an intermediate substrate(213), a processing chip(221), and a spacer(223). The intermediate substrate is prepared to electrically connect the lower part of the image sensor to the image sensor. The processing chip is formed on the lower part of the intermediate substrate. The spacer is prepared for the insulation between the processing chip and the intermediate substrate and is insulated.
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