发明名称 METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT SUBSTRATE, AND FLEXIBLE CIRCUIT SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To improve positional accuracy in laminating a cover film so as to prevent position gap in the width direction, when laminating the cover film to an elongated substrate material. SOLUTION: The elastic modulus of adhesive 3a, which adheres a cover film 3, is 50 or more times as opposed to the elastic modulus of a glass transition point of flexible polyolefin 5b which is an interlayer of a mold release film 5. Accordingly, when lamination press is performed by piling up order of a base film 1, the adhesive 3a, a cover film 2, and the mold release film 5, the flexible polyolefin 5b flows out in the direction of an arrow in the figure, and a heat-resistant film 5c under the mold release film 5 is also extended in the direction of the arrow, so that the cover film 2 is also extended in the direction of the arrow. At this moment, although the adhesive 3a already starts to soften, the elastic modulus of the adhesive 3a, which is much higher than that of the flexible polyolefin 5b, restrains the cover film 2 from sliding. Thus, in the cover film 2, positional gap in the width direction is not caused. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010098075(A) 申请公布日期 2010.04.30
申请号 JP20080266790 申请日期 2008.10.15
申请人 NIPPON MEKTRON LTD 发明人 SHOMURA MITSUNOBU;OTAKE SUKEO;GOSHI MASAHIRO;IKEDA SHINICHI
分类号 H05K3/28 主分类号 H05K3/28
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