| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma processing device which can apply a chamfering processing on the corner of an edge part of a workpiece individually and efficiently even if a small workpiece such as a crystal vibration chip is used. <P>SOLUTION: The plasma processing device 1 includes: a first electrode 21 and a second electrode 22 arranged facing each other, a mounting part which mounts a plate-shape work 10 between the first electrode 21 and the second electrode 22, a treatment gas supply means 6 which supplies a treating gas on the treating face 101 of the work 10, and a current flowing means 7 which makes electric current flow between the first electrode 21 and the second electrode 22. The first electrode 21 includes a recessed part 211 of a shape, in which the distance between the treating face 101 decreases gradually from the center side toward the edge part 102 of the work 10, on the face opposed to the treating face 101 of the work 10 mounted on the mounting part. <P>COPYRIGHT: (C)2010,JPO&INPIT |
