发明名称 HORIZONTAL ELECTROPLATING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a horizontal electroplating apparatus capable of achieving reduction in the cost of power supply equipment through suppression of power supply capacity and reduction in the running cost of electrical energy by reducing the distance between an energizing roll and an anode electrode and suppressing the voltage loss of a conductive strip plate to be electroplated. Ž<P>SOLUTION: A horizontal electroplating apparatus 10 includes an energizing roll 12 and a pressing roll 13 which carry a conductive strip plate 11 and anode electrodes 14 and 15 arranged by having a space on the surface of the conductive strip plate 11, wherein a plating solution 16 is fed between the conductive strip plate 11 and the anode electrodes 14 and 15 to electroplate the conductive strip plate 11. The outer diameter D of energized parts 21 and 22 on both sides in the axial direction of the energizing roll 12 is larger than the outer diameter d of other portions of the energizing roll 12. The energized parts 21 and 22 abut on the surface of the conductive strip plate 11. The anode electrode 14 has been arranged with a space in a space part 23 formed by the energizing roll 12 and the surface of the conductive strip plate 11 in the inside of the energized parts 21 and 22. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010095783(A) 申请公布日期 2010.04.30
申请号 JP20080270007 申请日期 2008.10.20
申请人 NIPPON STEEL ENGINEERING CO LTD;FUJIFILM CORP 发明人 SENOO TOSHIFUMI;SUMI TOMONORI;NISHIGUCHI SEIJI;OKAZAKI KENTARO
分类号 C25D7/06;C25D5/08;C25D17/12;C25D21/12 主分类号 C25D7/06
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