| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device which reduces an impact due to a difference among thermal expansion coefficients (TEC) in a wafer to improve a contact surface (interface) between a manufactured device and an adhesive layer and is built by an micro-system or nano-system on a wafer scale. <P>SOLUTION: The electronic device includes (a) an active surface of a component appeared on a side portion of a front surface 8, (b) a coating material 3 which exists at least in a lateral direction for a component and surely holds the component in the device, and (c) an insulation buffering layer 6 which does not exist on the active surface 10 of the component and separates the coating material 3 from the component 4. <P>COPYRIGHT: (C)2010,JPO&INPIT |
