发明名称 |
PLASMA PROCESSING APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma processing apparatus capable of improving an efficiency of production of plasma products and suppressing damage to an object to be processed due to a light beam emitted from plasma. <P>SOLUTION: The plasma processing apparatus includes: a process container capable of maintaining atmosphere having a pressure reduced below the atmospheric pressure; a pressure reducing means for reducing the inside of the process container to a predetermined pressure; a mounting table provided inside the process container and mounting an object to be processed; a first plasma generation device provided at a position separated from the process container; a second plasma generation device provided at a position separated from the process container; a first gas conveying pipe communicating the first plasma generation device with the second plasma generation device; a second gas conveying pipe communicating the second plasma generation device with the process container; and a gas introducing means for introducing process gas into the first plasma generation device. <P>COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010098174(A) |
申请公布日期 |
2010.04.30 |
申请号 |
JP20080268646 |
申请日期 |
2008.10.17 |
申请人 |
SHIBAURA MECHATRONICS CORP |
发明人 |
SAKAI TETSUYA |
分类号 |
H01L21/3065;C23F4/00;H05H1/46 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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