| 摘要 |
A printed circuit board (PCB) is disclosed. The PCB includes a dielectric layer, a power layer, a ground layer, and an electromagnetic interference reducing layer. The dielectric layer includes a central portion and a periphery portion surrounding the central portion. The dielectric layer defines a number of via holes through the periphery portion. The ground layer is adhered to a surface of the dielectric layer, covering both the central portion and the periphery portion. The power layer and the EMI reducing layer are separately adhered to another surface of the dielectric layer facing away from the conductive ground layer. The conductive power layer covers the central portion. The EMI reducing layer substantially covers the periphery portion and is electrically connected to the ground layer via the via holes.
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