摘要 |
The present invention relates to a method for the bonded adhesion, or connection, of a plurality of wire-shaped individual elements into an arrangement, particularly into a wire band, wherein the adjacent individual elements have predetermined breaking points allowing for the mechanical removal of the individual elements. The bonded adhesion is brought about according to the invention utilizing a two-layer system on the basis of acrylate resins consisting of an inner coating (A) and of an outer coating (B), wherein the inner coating (A) has a lower hardness, than the outer coating. In a further aspect the invention also comprises arranging a plurality of wire-shaped individual elements through such a bonded connection, particularly a wire band. |
申请人 |
HENKEL AG & CO. KGAA;KUNZ, ANDREAS;STODT, JUERGEN;ENDRES, HOLGER;SCHNEIDER, WOLFGANG;BONEKAMP, STEFAN;PODWOISKI, PATRICK |
发明人 |
KUNZ, ANDREAS;STODT, JUERGEN;ENDRES, HOLGER;SCHNEIDER, WOLFGANG;BONEKAMP, STEFAN;PODWOISKI, PATRICK |