PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A printed wiring board, a semiconductor package, and a manufacturing method thereof are provided to suppress breakdown of a solder bump by uniformly distributing mechanical stress into a connection pad and an under bump metal. CONSTITUTION: A printed wiring board comprises a dielectric layer(26a) and a connection pad(24). A dielectric layer has a main surface. A connection pad is buried in the dielectric layer. The connection pad includes a plate part(36) and a contact part(38). The plate part has a front side and a rear side. The contact part is positioned on the front side of the plate part. The main surface of the contact part is exposed to the main surface of the dielectric layer.