发明名称 BUFFER APPARATUS AND THIN FILM DEPOSITION SYSTEM
摘要 <p>A buffer apparatus and a thin film deposition system are provided. The buffer apparatus is connected between a liquid material supply apparatus and a deposition machine. The buffer apparatus includes a container and a baffle. The container is used for containing a liquid material supplied from the liquid material supply apparatus. The top of the container has an input hole and an output hole. The baffle is disposed in the container and located under the input hole. FIG 1</p>
申请公布号 SG160262(A1) 申请公布日期 2010.04.29
申请号 SG20080074486 申请日期 2008.10.02
申请人 UNITED MICROELECTRONICS CORP. 发明人 LIM CHENG-CHUNG;SUN ZHAO-JIN;TANG JUI-LING;PANG CHIN-KHYE;LIU YU-HENG
分类号 (IPC1-7):C23C16/00;C23C18/00;F15D1/10 主分类号 (IPC1-7):C23C16/00
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