发明名称 |
POLISHING PAD SEASONING METHOD, SEASONING PLATE, AND SEMICONDUCTOR POLISHING DEVICE |
摘要 |
A seasoning plate is placed on a polishing pad and performs seasoning of the polishing pad by abrading the polishing pad through the friction caused by rotation of the polishing pad. The seasoning plate includes: conditioners that abrade the polishing pad; a round flexible substrate that has the conditioners attached to the lower face thereof; an O-ring that is placed on the upper face of the flexible substrate, the O-ring forming a circle concentric with the flexible substrate; and a weight plate serving as a weight portion that is placed on the O-ring and applies weight for deforming the flexible substrate.
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申请公布号 |
US2010105295(A1) |
申请公布日期 |
2010.04.29 |
申请号 |
US20090607259 |
申请日期 |
2009.10.28 |
申请人 |
SUMCO TECHXIV CORPORATION |
发明人 |
MARUOKA DAISUKE;MOROIWA KOUDAI |
分类号 |
B24B1/00;B24B53/017;B24B53/12;H01L21/304 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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