COPPER ALLOY MATERIAL, ELECTRIC AND ELECTRONIC PARTS, AND COPPER ALLOY MATERIAL MANUFACTURING METHOD

摘要

Provided is a copper alloy material having an alloy composition comprising a total of 0.4-5.0 mass% of Ni or Co or both, 0.1-1.5 mass% of Si, and the remainder inevitable impurities, and wherein the area ratio of crystal particles in which the deviation angle of the orientation is 30° or less from the S orientation {2 3 1} <3 4 6> is 60% or greater with crystal orientation analysis by means of EBSD measurement. Also provided are electric and electronic parts formed by processing the copper alloy material, and a method for manufacturing the copper alloy material.