SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

摘要

The semiconductor device has a semiconductor substrate that includes an element, a first structural layer that includes a first insulating layer and first wiring electrically connected to the element and provided on one surface of the semiconductor substrate, a second structural layer that includes a second insulating layer and second wiring electrically connected to the first wiring, that is laminated on the first structural layer, and that is thicker than the first structural layer, and a third structural layer that includes a third insulating layer and third wiring and that is provided on the opposite surface of the semiconductor substrate from the surface where the first structural layer is provided.