发明名称 |
APPARATUS, METHOD AND COMPUTER PROGRAM PRODUCT FOR FAST SIMULATION OF MANUFACTURING EFFECTS DURING INTEGRATED CIRCUIT DESIGN |
摘要 |
<p>Methods, apparatus and computer program products provide a fast and accurate model for simulating the effects of chemical mechanical polishing (CMP) steps during fabrication of an integrated circuit by generating a design of an integrated circuit; while generating the design of the integrated circuit, using a simplified model to predict at least one physical characteristic of the integrated circuit which results from a CMP processing step to be used during manufacture of the integrated circuit, wherein the simplified model is derived from simulations performed prior to the design generation activities using a comprehensive simulation program used to model the physical characteristic; predicting performance of the integrated circuit using the predicted physical characteristic; and adjusting the design of the integrated circuit in dependence on the performance prediction.</p> |
申请公布号 |
SG160271(A1) |
申请公布日期 |
2010.04.29 |
申请号 |
SG20090048448 |
申请日期 |
2009.07.17 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
XIANG HUA;ECONOMIKOS LAERTIS;FAYAZ MOHAMMED FAZIL;PURI RUCHIR;GRECO STEPHEN EDWARD;O`NEIL PATRICIA A. |
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