发明名称 |
WIRING SUBSTRATE, SOLID-STATE IMAGING APPARATUS USING THE SAME, AND MANUFACTURING METHOD THEREOF |
摘要 |
In one embodiment, a miniaturized solid-state imaging apparatus includes a body having a cavity for mounting a semiconductor chip therein. The body has an overhanging portion extending toward the cavity. Further, a lead is disposed within the body. The lead has one end exposed through a top surface of the body and the other end exposed through a bottom surface of the body for electrical connection thereof.
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申请公布号 |
US2010102445(A1) |
申请公布日期 |
2010.04.29 |
申请号 |
US20090650610 |
申请日期 |
2009.12.31 |
申请人 |
CHO MIN-KYO;DOH JAE-CHEON;KWON YOUNG-SHIN |
发明人 |
CHO MIN-KYO;DOH JAE-CHEON;KWON YOUNG-SHIN |
分类号 |
H01L23/48;H01L27/14;H01L21/50;H01L23/00;H01L23/02;H01L23/04;H01L23/12;H01L23/50;H01L27/146;H01L27/148;H01L31/0203;H01L31/0232;H04N5/225;H04N5/335 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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