发明名称 |
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT |
摘要 |
<p>An electronic component (10) comprises a wire (12) extending to the opposite side of a lump portion (22) while nipping a terminal abutting portion (30), a metal terminal (20) made of a metal material and having the lump portion (22) including the end (14) of the wire (12), a base portion (flange portion (52)) for supporting the metal terminal (20), and the terminal abutting portion (30) made of an insulating material to abut against at least a part of the surface of the lump portion (22) and molded integrally with the flange portion (52) of a common insulating material. Its manufacturing method is also provided.</p> |
申请公布号 |
WO2010046955(A1) |
申请公布日期 |
2010.04.29 |
申请号 |
WO2008JP03030 |
申请日期 |
2008.10.24 |
申请人 |
SUMIDA CORPORATION;SATO, TSUYOSHI;SATO, SEIJI |
发明人 |
SATO, TSUYOSHI;SATO, SEIJI |
分类号 |
H01R4/02;B23K9/00;H01F5/04;H01F27/28;H01R43/02 |
主分类号 |
H01R4/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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