发明名称 ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
摘要 <p>An electronic component (10) comprises a wire (12) extending to the opposite side of a lump portion (22) while nipping a terminal abutting portion (30), a metal terminal (20) made of a metal material and having the lump portion (22) including the end (14) of the wire (12), a base portion (flange portion (52)) for supporting the metal terminal (20), and the terminal abutting portion (30) made of an insulating material to abut against at least a part of the surface of the lump portion (22) and molded integrally with the flange portion (52) of a common insulating material. Its manufacturing method is also provided.</p>
申请公布号 WO2010046955(A1) 申请公布日期 2010.04.29
申请号 WO2008JP03030 申请日期 2008.10.24
申请人 SUMIDA CORPORATION;SATO, TSUYOSHI;SATO, SEIJI 发明人 SATO, TSUYOSHI;SATO, SEIJI
分类号 H01R4/02;B23K9/00;H01F5/04;H01F27/28;H01R43/02 主分类号 H01R4/02
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