发明名称 |
EPOXY RESIN COMPOSITION, PREPREG USING THE EPOXY RESIN COMPOSITION, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD |
摘要 |
<p>Disclosed is an epoxy resin composition essentially containing an epoxy compound, a low-molecular-weight phenol-modified polyphenylene ether and a cyanate compound. This epoxy resin composition is excellent in dielectric characteristics and exhibits high heat resistance, while maintaining flame retardancy. Specifically disclosed is an epoxy resin composition which is a thermosetting resin composition composed of a resin varnish containing an epoxy compound (A) having a number average molecular weight of not more than 1000 and containing at least two epoxy groups in a molecule without containing a halogen atom, a polyphenylene ether (B) having a number average molecular weight of not more than 5000, a cyanate ester compound (C), a curing catalyst (D) and a halogen flame retardant (E). This epoxy resin composition is characterized in that the components (A)-(C) are dissolved in the resin varnish, while the component (E) is not dissolved but dispersed in the resin varnish.</p> |
申请公布号 |
KR20100044231(A) |
申请公布日期 |
2010.04.29 |
申请号 |
KR20107003936 |
申请日期 |
2008.06.30 |
申请人 |
PANASONIC ELECTRIC WORKS CO., LTD. |
发明人 |
FUJIWARA HIROAKI;IMAI MASAO;KITAI YUKI |
分类号 |
C08L63/00;B32B15/08;C08J5/24;H05K1/03 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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