发明名称 MULTI-PIECE BOARD AND FABRICATION METHOD THEREOF
摘要 A fabrication method for a multi-piece board includes: checking whether pieces (printed wiring boards) are defect-free or not; forming a first recess in a joint portion between a defective piece and a frame; forming a first fitting portion at the frame by separating the defective piece; cutting out a defect-free piece having a second fitting portion from another board; forming a second recess in the second fitting portion; fitting the second fitting portion into the first fitting portion; flattening a joint portion; and filling an adhesive in a third recess which is formed by the first recess and the second recess, and curing the adhesive to adhere the frame and the defect-free piece.
申请公布号 US2010101844(A1) 申请公布日期 2010.04.29
申请号 US20090499311 申请日期 2009.07.08
申请人 IBIDEN CO., LTD. 发明人 HASEGAWA YASUSHI
分类号 H05K1/00;H05K3/36 主分类号 H05K1/00
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