发明名称 METHOD OF ANALYZING THERMAL STRESS ACCORDING TO FILLING FACTOR OF FILLER IN RESIN
摘要 A method of analyzing thermal stress includes calculating a distribution of the number of fillers in a composite integrally molded product by using physical property values of resin material containing fillers, and determining a coefficient of linear expansion of the resin material in the composite integrally molded product, that is used as an input condition of a thermal stress analysis, based on the distribution of the number of the fillers.
申请公布号 US2010103977(A1) 申请公布日期 2010.04.29
申请号 US20090604009 申请日期 2009.10.22
申请人 ELPIDA MEMORY, INC. 发明人 KONO TSUTOMU;MINO MASAYUKI;TAKESHIMA HIDEHIRO;ITO YOUKOU;GOI TOMOKO
分类号 G01N3/60 主分类号 G01N3/60
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