COMPRESSION MOLDING METHOD AND DEVICE

摘要

The overall installation space for a semiconductor chip compression molding device (1) is efficiently reduced, the mold clamping force is effectively reduced for metal molds (5, 6) provided on the device (1), and when substrates (2) (2a, 2b) of different thicknesses are used, the clamping is adjusted efficiently according to the thicknesses of the substrates (2). The semiconductor chip compression molding device (1) is configured by stacking two metal molds (5, 6) (both the upper and lower molds) that are used for semiconductor chip compression molding. This device (1) is provided with a mold opening/closing means (12) that closes together the mold faces of the upper molds (5a, 6a), where the mold faces of the lower molds (5b, 6b) of the respective metal molds (5, 6) are arranged vertically. The mold opening/closing means (12) is configured by providing a mold opening/closing mechanism (13) having two racks (15, 16) and one pinion (17), and a thickness adjustment mechanism (14) that makes adjustments according to the thicknesses of the substrates (2) respectively supplied to the metal molds (5, 6) arranged vertically.