发明名称 Method for assembling printed circuit board with small mounted device-component, involves producing signal during deviation of actual condition around tolerance range, before assembling of printed circuit board with component
摘要 <p>The method involves pre-setting a specific assembly location (14) or a specific assembly position at the assembly location in relation to a printed circuit board (6) for components (2) with certain identity, as reference-condition. An actual condition of the components regarding to an existence at the assembly location, the identity and/or the assembly position in relation to the board is verified. A signal e.g. optical signal, is produced during deviation of the actual condition from the reference condition around a tolerance range, before assembling of the board with further component (22). An independent claim is also included for a device for assembling the printed circuit board with the small mounted device component.</p>
申请公布号 DE102008052661(A1) 申请公布日期 2010.04.29
申请号 DE20081052661 申请日期 2008.10.22
申请人 BMK PROFESSIONAL ELECTRONICS GMBH 发明人 BAUR, STEPHAN;SIGL, MATTHAEUS
分类号 H05K13/02;H05K13/08 主分类号 H05K13/02
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