发明名称 |
Method for assembling printed circuit board with small mounted device-component, involves producing signal during deviation of actual condition around tolerance range, before assembling of printed circuit board with component |
摘要 |
<p>The method involves pre-setting a specific assembly location (14) or a specific assembly position at the assembly location in relation to a printed circuit board (6) for components (2) with certain identity, as reference-condition. An actual condition of the components regarding to an existence at the assembly location, the identity and/or the assembly position in relation to the board is verified. A signal e.g. optical signal, is produced during deviation of the actual condition from the reference condition around a tolerance range, before assembling of the board with further component (22). An independent claim is also included for a device for assembling the printed circuit board with the small mounted device component.</p> |
申请公布号 |
DE102008052661(A1) |
申请公布日期 |
2010.04.29 |
申请号 |
DE20081052661 |
申请日期 |
2008.10.22 |
申请人 |
BMK PROFESSIONAL ELECTRONICS GMBH |
发明人 |
BAUR, STEPHAN;SIGL, MATTHAEUS |
分类号 |
H05K13/02;H05K13/08 |
主分类号 |
H05K13/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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