RESIN FOR THERMAL IMPRINTING, RESIN SOLUTION FOR THERMAL IMPRINTING, INJECTION MOLDED BODY FOR THERMAL IMPRINTING, THIN FILM FOR THERMAL IMPRINTING, AND PROCESS FOR PRODUCING THE THIN FILM

摘要

This invention provides a resin for thermal imprinting, which, in microfabrication by thermal imprinting, can suppress the occurrence of particles by virtue of excellent heat deterioration resistance, has low resin modulus of elasticity during fluidization, and has good fine pattern transfer properties, a resin solution for thermal imprinting using the resin, an injection molded body for thermal imprinting using the resin, a thin film for thermal imprinting using the resin, and a process for producing the thin film. For the resin for thermal imprinting, the exothermic onset temperature (oxidation onset temperature) of an exothermic peak involved in oxidation as measured with a differential scanning calorimeter in the air at a temperature rise rate of 5°C/min is the glass transition temperature of the resin + 35°C or above, and the complex modulus of the resin at the glass transition temperature of the resin + 35°C in terms of dynamic viscoelasticity in a nitrogen stream at a frequency of 1 rad/sec is less than 0.24 MPa.