TEMPLATE FOR FORMING SOLDER BUMP AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A template for forming solder bumps and a method for manufacturing the same are provided to improve the identification accuracy of the alignment-mark between a substrate and the template by opacifying the other region except for the alignment mark of the template. CONSTITUTION: A receiving groove(111) is formed for receiving a solder ball on one side of a first substrate(110). A first substrate is based on a transparent material. A second substrate is arranged on the other side of the first substrate. The second substrate is based on an opaque material. The area of the second substrate is smaller than the first substrate. A junction layer(130) is interposed between the first substrate and the second substrate.