发明名称 |
SEMICONDUCTOR ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE USING THE SAME |
摘要 |
The problem of the present invention is to provide a chip-on-chip type semiconductor electronic component and a semiconductor device which can meet the requirements for further density increase of semiconductor integrated circuits. The present invention provides: a chip-on-chip type semiconductor electronic component in which a circuit surface of a first semiconductor chip and a circuit surface of a second semiconductor chip are opposed to each other, wherein the distance X between the first semiconductor chip and the second semiconductor chip is 50 μm or less, and the shortest distance Y between the side surface of the second semiconductor chip and the first external electrode is 1 mm or less; and a semiconductor device comprising the same.
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申请公布号 |
US2010102446(A1) |
申请公布日期 |
2010.04.29 |
申请号 |
US20070447658 |
申请日期 |
2007.10.30 |
申请人 |
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发明人 |
KATSURAYAMA SATORU;YAMASHIRO TOMOE;HIRANO TAKASHI |
分类号 |
H01L23/498;H01L23/28;H01L23/538 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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