| 摘要 |
A wiring substrate, includes a first wiring layer, an insulating layer formed on the first wiring layer, a via conductor filled to penetrate the insulating layer in a thickness direction and connected to a connection portion of the first wiring layer, and a second wiring layer which is formed on the insulating layer and whose connection portion is connected to the via conductor, wherein, out of the first wiring layer and the second wiring layer, the connection portion of one wiring layer is formed as a land whose diameter is larger than a diameter of the via conductor, and the connection portion of other wiring layer is formed as a landless wiring portion whose diameter is equal to or smaller than a diameter of the via conductor.
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